Intel Ships Glass-Substrate Xeon 6+ CPUs as TSMC Completes CoPoS Trial Line in 2026

According to industry sources, Intel has entered the production and shipping phase for its Xeon 6+ Clearwater Forest processors featuring glass substrate interposers as of 2026, making it the earliest mover in commercializing advanced glass-based packaging. Meanwhile, TSMC completed the construction of its CoPoS glass substrate trial line in June 2026 following equipment delivery in February, planning to significantly scale production between 2028 and 2029 to replace its legacy CoWoS technology. Samsung is also advancing its efforts, planning to establish a pilot production line by late 2026 and commence mass production from 2027 onward through its partnership with Sumitomo Chemical, focusing on HBM4 memory packaging applications.
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