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Micron Expands Hiroshima Fab with $9.3B Investment for HBM Production, July 4 Groundbreaking

2026-07-06 01:19:23

On July 4, Micron Technology officially began expanding its Hiroshima wafer facility with a 1.5 trillion yen (approximately $9.3 billion) investment to produce high-bandwidth memory (HBM) and advanced memory chips for AI processors. The Japanese government will provide subsidies of up to 500 billion yen. Production is expected to commence in summer 2028. The project is part of Micron's broader effort to expand AI storage capacity, with parallel major investments underway in Idaho and New York.

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