Simbest Microelectronics (03661) Completes IPO Subscription with 111.6x Oversubscription, HK$51.8 Billion in Margin Financing

According to market sources, Simbest Microelectronics (03661) completed its IPO subscription on June 23, 2026, achieving an oversubscription rate of 111.6 times with HK$51.8 billion in margin financing secured. The company is set to list on June 26, 2026, with pricing at HK$85.20 per share and total fundraising of approximately HK$4.6 billion.

A consortium of 29 cornerstone investors, including GIC Private Limited, JPMorgan Asset Management, CPE Ginkgo, and others, has committed to purchase US$293 million worth of shares. China International Capital Corporation and Huatai International serve as joint sponsors. As China's leading analog integrated circuit manufacturer, Simbest ranked first among domestic peers and eighth globally in 2025 by revenue.