TSMC Plans Shift to Glass Interposer Technology with CoPoS by Around 2029

According to semiconductor analyst Andrew Lu, Taiwan Semiconductor Manufacturing Company (TSMC) is planning to transition from silicon interposers to glass interposers using CoPoS (Chip-on-Panel-on-Substrate) technology by around 2029. The shift aims to address capacity constraints as AI chip designs grow larger, requiring higher volumes of memory stacks.

Lu projects TSMC's CoWoS capacity to reach approximately 200,000 units per month by end of 2026, growing to 280,000 units in 2027 and 360,000 units in 2028. CoPoS technology is expected to begin limited trial production in 2028, with mass production acceleration starting in 2029, targeting around 12,000 units per month by year-end 2029.