ASE Raises Semiconductor Packaging Prices by Over 20% on July 1

According to Odaily, on July 1, ASE (Advanced Semiconductor Engineering), the world's largest semiconductor packaging, assembly and test (OSAT) supplier, announced price increases of over 20% for its packaging services. The price hike covers advanced packaging technologies including chip-on-wafer-on-substrate (CoWoS) and fan-out chip-on-substrate (FoCoS) solutions.
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