EUV Chip Manufacturing Dominance Challenged by Emerging Lithography Technologies by 2030

According to Forbes, advanced chip manufacturing faces potential disruption as multiple emerging lithography technologies approach commercialization by 2030. Atomic lithography uses atomic beams directly etched on silicon wafers, potentially shrinking chip line widths 1-2 orders of magnitude smaller than current EUV capabilities. X-ray lithography, with wavelengths below 1 nanometer, theoretically enables even more precise transistor structures. Recently, Huawei announced development of a new semiconductor architecture designed to manufacture advanced AI chips without relying on EUV technology, demonstrating the industry's push toward alternatives to the current dominant lithography method.
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