Samsung Electro-Mechanics Begins Mass Production of FC-BGA Substrate for Qualcomm AI200 Accelerator

According to BlockBeats, on June 22, Samsung Electro-Mechanics began mass production of FC-BGA (flip-chip ball grid array) substrate for Qualcomm's first data center AI accelerator, AI200, at its Busan facility. The AI200, launched by Qualcomm in October 2025, is designed for AI inference workloads and features custom Oryon CPU and Hexagon NPU cores. The partnership marks Samsung Electro-Mechanics' expansion from mobile and PC markets into data center infrastructure alongside Qualcomm.
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