ASM Pacific Raises Semiconductor Packaging Prices Over 20% on July 1

According to Odaily, today (July 1), ASM Pacific Technology, the world's leading semiconductor outsourced assembly and test (OSAT) supplier, announced a price increase for packaging services, with prices rising over 20% for advanced packaging types including chip-on-wafer-on-substrate (CoWoS) and fan-out chip-on-substrate (FoCoS).
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